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Flexible polyurethane system for potting and casting in electrical applications. A two component, low viscosity, low durometer, polyurethane potting compound. The cured material meets the requirements of UL94-V0. CLP 7106 / CLI 4010
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Low Exotherm, Low shrinkage epoxy. A two component, long pot life casting system with low exotherm, low shrinkage and excellent thermal shock resistance. CLR 1066 / CLH 6520
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Low viscosity, RT cure. Impact resistant. Excellent thermal cycle. An exceptionally tough epoxy casting system with excellent low temperature thermal and mechanical shock resistance. CLR 1190 / CLH 6560
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Room Temperature Cure, filled epoxy system suitable for machine dispense. Developed for potting and casting of electrical and electronic components. The cured material exhibits excellent thermal cycling endurance. CLR 1556 / CLH 6640
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A low viscosity, single component, epoxy potting and encapsulating compound. The product has excellent stability and good adhesion to a wide range of substrates. This product meets UL 94-HB flammability requirements. Heat Cure Single Component semi-flexible epoxy potting and encapsulating system. Product is suitable for potting ferrites and pressure sensitive components in electrical and electronic applications. CLS 9611
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Heat Cure. Single Component semi-flexible epoxy potting and encapsulating system. Product is suitable for potting ferrites and pressure sensitive components in electrical and electronic applications. Low viscosity. The product has excellent stability and good adhesion to a wide range of substrates. This product meets UL94-HB flammability requirements. CLS 9616
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The product cures to a shore hardness of 50 A, low viscosity, soft system. A two component, very flexible epoxy system. XRD 1347 / XHD 1348
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4:1 Ratio, soft system. A two component unfilled, flexible epoxy system. Product features low viscosity, long pot life and cures to a shore hardness of 70A. XRD 1501 / CLH 6090